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| Requirement | Conformity |
|---|---|
| ISOLATION OF DIFFERENT LINES / CARS | Layer 3 routing protocols |
| FAULT TOLERANCE. REDUNDANCY | Supports multiple ring redundancy protocol such as STP/RSTP/MSTP, DRP |
| RESISTANT TO STRONG ELECTROMAGNETIC INTERFERENCE AND SURGE VOLTAGE. | Complies with EN50121-4, high EMC |
| EXTENDED TEMPERATURE RANGE | Supports -40 to 85°C operating temperature range |
| Requirement | Conformity |
|---|---|
| ISOLATION OF DIFFERENT LINES / CARS | Layer 3 routing protocols |
| FAULT TOLERANCE. REDUNDANCY | Supports multiple ring redundancy protocol such as STP/RSTP/MSTP, DRP |
| RESISTANT TO STRONG ELECTROMAGNETIC INTERFERENCE AND SURGE VOLTAGE. | Complies with EN50121-4, high EMC |
| EXTENDED TEMPERATURE RANGE | Supports -40 to 85°C operating temperature range |
| Requirement | Conformity |
|---|---|
| AUTOMATIC GENERATION OF TRAIN BUS TOPOLOGY WHEN FORMING A TRAIN. ETB AUTOMATIC CHANGE OF IP ADDRESSES OF ETHERNET SWITCHES ACCORDING TO TRAIN ALLOCATION (TTDP) | The XBIT series is specifically designed for onboard ETB and ECN applications. ETBN complies with IEC61375-2-5 and IEC61375-2-3 standards. ECN complies with IEC61375-3-4. Supports TTDP, which allows you to automatically create and maintain the train communication network topology. |
| TRAIN LEVEL IP ADDRESS AND CONSTRUCTION LEVEL IP ADDRESS CONVERSION | Assignment of IP addresses according to the rules defined by IEC61375. |
| NETWORK REDUNDANCY | Supports VRRP and implements ETBN redundancy in the composition. |
| RELIABLE INDUSTRIAL DESIGN | Design that protects against shock, vibration, high level of electromagnetic interference, unstable power supply of the on-board network. |
| Requirement | Conformity |
|---|---|
| AUTOMATIC GENERATION OF TRAIN BUS TOPOLOGY WHEN FORMING A TRAIN. ETB AUTOMATIC CHANGE OF IP ADDRESSES OF ETHERNET SWITCHES ACCORDING TO TRAIN ALLOCATION (TTDP) | The XBIT series is specifically designed for onboard ETB and ECN applications. ETBN complies with IEC61375-2-5 and IEC61375-2-3 standards. ECN complies with IEC61375-3-4. Supports TTDP, which allows you to automatically create and maintain the train communication network topology. |
| TRAIN LEVEL IP ADDRESS AND CONSTRUCTION LEVEL IP ADDRESS CONVERSION | Assignment of IP addresses according to the rules defined by IEC61375. |
| NETWORK REDUNDANCY | Supports VRRP and implements ETBN redundancy in the composition. |
| RELIABLE INDUSTRIAL DESIGN | Design that protects against shock, vibration, high level of electromagnetic interference, unstable power supply of the on-board network. |
| Requirement | Conformity |
|---|---|
| NETWORK REDUNDANCY | Supports universal ring technologies such as STP/RSTP/MSTP and IEC62439-6 (DRP) |
| MULTICAST FUNCTION | Supports IGMP Snooping, GMRP |
| POE OUTPUTS | PoE output for low to medium power electronics such as information displays. Compliant with IEEE802.3af IEEE802.3at PoE |
| RELIABLE INTERFACES | Complies with EN50155 with M12 connectors for embedded Ethernet switches |
| HIGH PROTECTION CLASS THAT PREVENT DAMAGE BY DUST AND MOISTURE. | Degree of protection from IP40 to IP65 |
| Requirement | Conformity |
|---|---|
| NETWORK REDUNDANCY | Supports universal ring technologies such as STP/RSTP/MSTP and IEC62439-6 (DRP) |
| MULTICAST FUNCTION | Supports IGMP Snooping, GMRP |
| POE OUTPUTS | PoE output for low to medium power electronics such as information displays. Compliant with IEEE802.3af IEEE802.3at PoE |
| RELIABLE INTERFACES | Complies with EN50155 with M12 connectors for embedded Ethernet switches |
| HIGH PROTECTION CLASS THAT PREVENT DAMAGE BY DUST AND MOISTURE. | Degree of protection from IP40 to IP65 |
| Requirement | Conformity |
|---|---|
| HIGH AVAILABILITY WITH LOW FAULT RATE | Fanless design, dual power supplies with long MTBF (> 200,000 hours) |
| INDUSTRIAL DESIGN RESISTANT TO IMPACT AND VIBRATION AND TO EXTREME OPERATING TEMPERATURES | Supports a wide operating temperature range of -40 to 85°C and high EMI immunity |
| NETWORK REDUNDANCY TO MITIGATE THE CONSEQUENCES OF A LINK OR NODE FAILURE | Supports various redundant ring redundancy protocols such as STP/RSTP, MSTP and IEC62439-6 (DRP) |
| HIGH CAPACITY AND ROUTING PLATFORM FOR INTERSTATION COMMMUNICATION | Supports Layer 3 routing protocols such as RIP and OSPF for 10G |
| ROUTING RESERVATION SUPPORT FOR DATA EXCHANGE WITH EXTERNAL NETWORK | Supports VRRP for Layer 3 redundancy |
| Requirement | Conformity |
|---|---|
| HIGH AVAILABILITY WITH LOW FAULT RATE | Fanless design, dual power supplies with long MTBF (> 200,000 hours) |
| INDUSTRIAL DESIGN RESISTANT TO IMPACT AND VIBRATION AND TO EXTREME OPERATING TEMPERATURES | Supports a wide operating temperature range of -40 to 85°C and high EMI immunity |
| NETWORK REDUNDANCY TO MITIGATE THE CONSEQUENCES OF A LINK OR NODE FAILURE | Supports various redundant ring redundancy protocols such as STP/RSTP, MSTP and IEC62439-6 (DRP) |
| HIGH CAPACITY AND ROUTING PLATFORM FOR INTERSTATION COMMMUNICATION | Supports Layer 3 routing protocols such as RIP and OSPF for 10G |
| ROUTING RESERVATION SUPPORT FOR DATA EXCHANGE WITH EXTERNAL NETWORK | Supports VRRP for Layer 3 redundancy |